COB packaging technology is not much different from the production process of SMD LED lamps, but COB packaging is more efficient in dispensing, separation, segmentation and packaging, and can save 5% of any and material costs compared with traditional SMD. So, compared with the traditional packaging technology, what are the advantages of COB technology?

1, the packaging efficiency is high and the cost is saved.

There is little difference between COB packaging technology and SMD LED lamp production technology, but COB packaging is much more efficient in dispensing, separation, light splitting and packaging, and can save 5% of any and material costs compared with traditional SMD.

2. Advantages of low thermal resistance

The thermal resistance structure of traditional SMD packaging system is: chip-die attach-solder-solder paste-copper foil-insulating layer-aluminum. The system thermal resistance of COB package is: chip-die bond-aluminum. The system thermal resistance of COB package is much lower than that of traditional SMD package, so the service life of LED lamps in COB package is greatly improved.

3. Advantages of light quality

The traditional SMD package is to paste multiple discrete devices on the PCB in the form of SMD, which is used as the light source element of LED application, but there are some problems such as light gathering, glare and ghosting. COB package is an integrated package and a surface light source, with large viewing angle and convenient adjustment, which reduces the refractive loss of light.

The traditional SMD packaging method is to attach some different devices to PCB to form LED light source elements. COB light source does not have the above problems. It is a surface light source with large viewing angle, easy to adjust the angle, and reduces the loss caused by light refraction.

4. Application advantages

COB light source is very convenient to use and can be directly applied to lamps without other processes. However, the traditional SMD packaging light source needs to be SMD first, and then fixed on the PCB by reflow soldering. It is not as convenient as COB in application.

COB packaging technology is not much different from the production process of SMD LED lamps, but COB packaging is more efficient in dispensing, separation, segmentation and packaging, and can save 5% of any and material costs compared with traditional SMD. So, compared with the traditional packaging technology, what are the advantages of COB technology?

1, the packaging efficiency is high and the cost is saved.

There is little difference between COB packaging technology and SMD LED lamp production technology, but COB packaging is much more efficient in dispensing, separation, light splitting and packaging, and can save 5% of any and material costs compared with traditional SMD.

2. Advantages of low thermal resistance

The thermal resistance structure of traditional SMD packaging system is: chip-die attach-solder-solder paste-copper foil-insulating layer-aluminum. The system thermal resistance of COB package is: chip-die bond-aluminum. The system thermal resistance of COB package is much lower than that of traditional SMD package, so the service life of LED lamps in COB package is greatly improved.

3. Advantages of light quality

The traditional SMD package is to paste multiple discrete devices on the PCB in the form of SMD, which is used as the light source element of LED application, but there are some problems such as light gathering, glare and ghosting. COB package is an integrated package and a surface light source, with large viewing angle and convenient adjustment, which reduces the refractive loss of light.

The traditional SMD packaging method is to attach some different devices to PCB to form LED light source elements. COB light source does not have the above problems. It is a surface light source with large viewing angle, easy to adjust the angle, and reduces the loss caused by light refraction.

4. Application advantages

COB light source is very convenient to use and can be directly applied to lamps without other processes. However, the traditional SMD packaging light source needs to be SMD first, and then fixed on the PCB by reflow soldering. It is not as convenient as COB in application.